Semiconductors Team
New Research
隨著科技的持續進步,先進封裝技術已成為半導體產業的一大焦點。 本研究報告提供一個全面的市場分析,包括主要的供應商、技術趨勢、應用領域和競爭情況。IDC 資深研究經理曾冠瑋表示:「半導體技術發展為長期趨勢,晶片功能要求不斷提高,先進封裝技術尤為重要,在一個封裝內整合多種晶片與元件,透過將晶片與其他元件緊密結合,減少互連的距離,從而降低延遲並提高數據傳輸速度和整體性能。透過先進封裝,能夠與先進製程相輔相成,繼續推進摩爾定律(Moore's Law)的邊界,進一步推動全球科技蓬勃發...
This IDC Market Note explores the introduction of the hard drive industry's first 11-disk platform for hard disk drives (HDDs) by Western Digital (WD), branded as Ultrastar DC. "WD continues to evolve its product portfolio with the introduc...
This IDC Market Perspective provides a preliminary unit shipment range for worldwide hard disk drive (HDD) units by HDD drive class and estimated supplier market share for 3Q24."HDD demand is expected to show strong growth again last quarte...
This IDC presentation presents a five-year (2024–2028) artificial intelligence (AI) IT spending forecast by AI type, buyer type, and IT product/services categories. "IDC sees continued strong investment in IT products and services to enable...
This IDC Market Presentation provides an overview of the worldwide total and ODM direct market for AI systems through 2Q24, as well as the latest update on AI system development and vendor performance.
This IDC Market Presentation discusses the results for 2Q24 for networking and communications infrastructure processing semiconductors. This Market Presentation covers the overall networking and communications infrastructure semiconductor m...
This IDC study provides a detailed taxonomy for the dedicated cloud infrastructure and services market. The document covers the definitions of various building blocks and provides a top-level overview of dedicated cloud segments. IDC is ret...
This IDC Market Analysis Perspective (MAP) summarizes key demand and supply trends driving compute and storage service provider infrastructure, particularly the ODM Direct infrastructure market. The MAP includes market forecast and vendor d...
This IDC Market Presentation offers an overview of the worldwide ODM Direct infrastructure market trend in the viewpoint of final assembly in first half year of 2024.
This presentation will provide in-depth insights into the semiconductor supply chain outlook.In the semiconductor supply chain, fabless, foundry, and outsourced semiconductor assembly and test (OSAT), which cover integrated circuit (IC) des...
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