target audience: TECH SUPPLIER Publication date: Sep 2024 - Document type: Market Presentation - Doc Document number: # US51694124
2025 Worldwide Semiconductor Supply Chain Outlook: Fabless, Foundry, Outsourced Semiconductor Assembly and Test, and Advanced Packaging Opportunities
Content
- 26 slides
Get More
When you purchase this document, the purchase price can be applied to the cost of an annual subscription, giving you access to more research for your investment.
Related Links
Abstract
This presentation will provide in-depth insights into the semiconductor supply chain outlook.
In the semiconductor supply chain, fabless, foundry, and outsourced semiconductor assembly and test (OSAT), which cover integrated circuit (IC) design, manufacturing, and packaging, are the upstream, midstream, and downstream players that work together to complete IC products. With the continuous development of the chipset system architecture, advanced packaging is also needed to complete the architecture. This report will analyze IC design, foundry, packaging, and advanced packaging and explore the industry's challenges and opportunities, providing forward-looking insights for the industry.
"In 2024, driven by the demand for AI and high-power compute (HPC), the semiconductor market will start to recover, and the supply chain will gradually grow again. The fabless, foundry, OSAT, and advanced packaging industries are expected to grow in 2024, laying the foundation for continued growth in 2025. In 2025, IDC expects the semiconductor market to still be in a recovery cycle, and the semiconductor supply chain will have a new round of market opportunities," says Galen Zeng, senior research manager, IDC.