Worldwide Outsourced Semiconductor Assembly and Test Manufacturing Market Share, 2022 ─ Vendor Ranking and Insight

IDC Market Share Figure

• Figure: Worldwide Outsourced Semiconductor Assembly and Test Manufacturing 2022 Market Share Snapshot

Executive Summary

Advice for Technology Suppliers

Market Share

• Table: Worldwide OSAT Revenue by Vendor, 2021–2022 (US$M)

Who Shaped the Year

• ASE

• Figure: Consolidated Revenue of ASE, 1Q21–4Q22

• Figure: ASE ATM Business Share by Application, 1Q21–4Q22

• Amkor

• Figure: Amkor Revenue, 1Q21–4Q22

• Figure: Amkor Product Share by Application, 1Q21–4Q22

• JCET

• Figure: JCET Revenue, 1Q21–4Q22

• Table: JCET Product Sales, 2022 (Unit: 100 Million)

• TFME

• Figure: TFME Revenue, 1Q21–4Q22

• Table: TFME Product Sales, 2022 (Unit: 100 Million)

• PTI

• Figure: PTI Revenue, 1Q21–4Q22

• Tianshui Huatian

• Figure: Tianshui Huatian Revenue, 1Q21–4Q22

• Table: Tianshui Huatian Product Sales, 2022 (Unit: 100 Million)

• KYEC

• Figure: KYEC Revenue (by Application), 1Q21–4Q22

• Chipbond and ChipMOS

• Figure: Chipbond Revenue, 1Q21–4Q22

• Figure: ChipMOS Revenue (by Application), 1Q21–4Q22

• Sigurd

• Figure: Sigurd's Revenue, 1Q21–4Q22

Market Context

• Packaging Technology Development

• Figure: Evolution of Packaging Technologies and Development Flows

• Capex

• Figure: Capex of the World's Top 10 OSAT Vendors, 1Q21–4Q22

• Significant Market Developments

• Regional Revenue Share

• Figure: Revenue of the World's Top 10 OSAT Vendors by Region, 2021–2022

• Heterogeneous Integration — Taking ASE, an ASM Leader, as an Example

• Figure: Six Core Packaging Technologies for ASE's VIPack

• Review of 2022 and Outlook for 2023

Methodology

Market Definition

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