target audience: TECH SUPPLIER  Publication date: Nov 2023 - Document type: Market Forecast - Doc  Document number: # US50501823

Worldwide Semiconductor Advanced Packaging Technology Market Forecast and Analysis, 2023–2028

By:  Galen Zeng Loading

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Table of Contents


  • IDC Market Forecast Figure

    • Figure: Worldwide Advanced Packaging Revenue Snapshot

  • Executive Summary

  • Advice for Technology Suppliers

  • Market Forecast

    • Market Trends

    • Figure: Packaging Market Share, 2021–2028

    • Figure: Advanced Packaging Market Revenue, 2021–2028

    • Figure: Advanced Packaging Market Revenue by Technology Type, 2021–2028

    • Types of Participating Vendors and Industry Trends

    • Figure: Contribution to Advanced Packaging Market Revenue by Player, 2022–2028

    • Figure: Advanced Packaging Market Share by Player, 2023 and 2028

  • Market Context

    • Drivers and Inhibitors

    • Drivers

    • Policy and Industry Collaboration for Promoting Advanced Packaging Technologies

    • Market Competition and Cooperation

    • Versatility of Advanced Packaging technology

    • Inhibitors

    • Technological Complexity and Huge Demand for R&D Investment

    • Market Competition and Price Pressure

    • Significant Market Developments

    • Main Applications

    • Figure: Advanced Packaging Revenue by Segment, 2023–2028

    • TSMC's Chip-on-Wafer-on-Substrate

    • Table: TSMC's CoWoS Capacity, 2022–2024

    • Table: TSMC's CoWoS Customer Share, 2023

    • Changes from Prior Forecast

  • Market Definition

    • Table: Advanced Packaging Technologies

  • Methodology

  • Related Research