target audience: TECH SUPPLIER Publication date: Nov 2024 - Document type: Market Analysis Perspective - Doc Document number: # US51694324
Market Analysis Perspective: Worldwide Semiconductor Supply Chain — Advanced Packaging Market, 2024
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Abstract
This IDC study provides a comprehensive market analysis on the worldwide semiconductor supply chain, encompassing the main suppliers, technology trends, application fields, and the competitive landscape.
Driven by the ongoing progress in science and technology, advanced packaging technology has become a major focus of the semiconductor industry.
"Along with the enduring development trend of semiconductor technology, higher demand for chip functionality and advanced packaging technology has emerged. This enables the close integration of a variety of chips and components in one package to reduce the interconnect distance, thereby lowering latency and improving data transmission speed and overall performance. Advanced packaging, complemented with advanced manufacturing processes, can help further extend the limits of Moore's Law and drive the global technology boom," says Galen Zeng, senior research manager, IDC.